Wafer-level packaging of electronic devices before singulation
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United States of America Patent
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Mar 15, 2005
Grant Date -
May 27, 2004
app pub date -
Nov 27, 2002
filing date -
Nov 27, 2002
priority date (Note) -
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Abstract
In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.
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