Apparatus and method for holding a semiconductor wafer using centrifugal force
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United States of America Patent
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Issued Date -
May 20, 2004
app pub date -
Nov 15, 2002
filing date -
Nov 15, 2002
priority date (Note) -
Abandoned
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Abstract
An apparatus and method for holding a semiconductor wafer utilizes confining members having a wafer engaging end to both support and confine the semiconductor wafer using centrifugal force when the wafer and the confining members are being rotated about a rotational axis. The confining members may be configured to be pivoted when subjected to centrifugal force caused by the rotation of the confining members such that pressure is applied on the wafer edge by the wafer engaging end of each confining member in a radial direction toward the rotational axis when the confining members are pivoted.
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