System-in-a-package device
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United States of America Patent
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N/A
Issued Date -
May 6, 2004
app pub date -
Oct 30, 2002
filing date -
Oct 30, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system-in-a-package device installs a second surface of an integrated passive devices (IPD) substrate onto a bearing substrate to achieve electric connection. At least an active device is then installed on a first surface of the IPD substrate by means of flip chip or wire bonding to achieve electric connection. Next, an encapsulant is formed to at least cover the active device or its contacts with the IPD substrate for protection. The system-in-a-package device uses conducting holes of the bearing substrate as contacts with the exterior. Thereby, more functions can be directly integrated into the same package to have the advantages of small package size, increased efficiency, and fast fabrication speed.
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