Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly
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United States of America Patent
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app pub date -
Oct 30, 2002
filing date -
Oct 30, 2002
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Abandoned
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Abstract
A method and structure for controlling solder spread in a predefined/designed area during flip chip assembly build is disclosed. Using conventional processes used in the art blind holes or dimples are incorporated onto the lead frame which then act as containers or wells trapping the solder and thereby preventing it from spreading wider.
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