Solder ball holding terminal in a BGA arrangement
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United States of America Patent
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May 11, 2004
Issued Date -
N/A
app pub date -
Oct 21, 2002
filing date -
Oct 21, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A solder ball holding terminal has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate. The first plate has a first distal end, the second plate has a second distal end and the third plate has a third distal end and a fourth distal end. A distance between the third distal end and the fourth distal end is much smaller than that between the first distal end and the second distal end such that when a solder ball is inserted into a space defined among the first distal end, the second distal end, the third distal end and the fourth distal end, a substantially three-point support is provided to the solder ball so that the solder ball is securely clamped.
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