Metal safe stabilized stripper for removing cured polymeric layers and negative tone acrylic photoresists
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United States of America Patent
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Issued Date -
Apr 22, 2004
app pub date -
Oct 17, 2002
filing date -
Oct 17, 2002
priority date (Note) -
Abandoned
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Abstract
A stabilized stripping composition is provided for removing fully cured polymeric organic substances from an inorganic substrate, including polyimide and liquid crystal polymer (LCP). The stripping composition comprises about 3 to about 15 percent of benzyltrimethylammonium hydroxide (BTMAH), about 50 to about 87.5 weight percent of n-methylpyrrolidone as a solvent with ethylene glycol ranging from 15 to about 45 weight percent and a stabilizer. The stripping composition preferable also contains a suitable corrosion inhibitor and a non-ionic surfactant. Also provided is a method for stripping thick negative-tone photoresists, e.g. acrylic, styrenic, maleic anhydride, and similar, from inorganic substrates by contacting the polymeric organic substance with the organic stripping BTMAH composition for a period of time sufficient to dissolve and remove said polymeric substances.
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