Apparatus for processing binding film for manufacturing copper clad laminate board and circuit board
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United States of America Patent
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Issued Date -
Apr 22, 2004
app pub date -
Oct 21, 2002
filing date -
Oct 21, 2002
priority date (Note) -
Abandoned
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Abstract
An apparatus for processing binding film is provided. The apparatus comprises a workstation board and a feeder for supplying the binding film, wherein the feeder is disposed at a front-end side of the workstation board. A separating set comprising a metering roller and a plurality of knifes, a slot-flush set comprising a plurality of flushing heads, and a knife set, are disposed at predetermined positions over the workstation board. The slot flushing, separation and cutting process steps are executed in a single step. A receiving section is disposed at a distal end side of the workstation board and behind the knife set. The processed binding film sheets are automatically received and stacked.
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