Method and device for applying a solder to a substrate
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United States of America Patent
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Issued Date -
Apr 15, 2004
app pub date -
Aug 20, 2003
filing date -
Jul 10, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention is a method for applying a solder to a substrate by positioning it in its solid physical condition, melting it and then impacting it against a substrate by means of compressed gas. The device for applying a solder (7) to a substrate (10, 11) comprises a holder (1) having a capillary bore (2) whose diameter, at the substrate end (3), has a contraction (4) whose diameter (D2) is smaller than the diameter (D3) of the solder globule (7).
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