Exhaust heat utilization system, exhaust heat utilization method, and semiconductor production facility
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Aug 19, 2003
filing date -
Feb 20, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An exhaust-heat utilization system is constructed which can achieve energy saving of semiconductor manufacturing facilities by reusing a warmed cooling-water, as a heating source, exhausted from semiconductor manufacturing apparatuses. Supply a low-temperature cooling-water having a temperature substantially equal to a room temperature to the semiconductor manufacturing apparatuses (2, 4, 6, 8, 10) through a low-temperature cooling-water line (12). Supply a medium-temperature cooling-water to the semiconductor manufacturing apparatus (8) through a medium-temperature cooling-water supply line (30), the medium-temperature cooling-water being exhausted from the semiconductor manufacturing apparatuses and having a temperature higher than the room temperature. Supply, as a heating source, a high-temperature cooling-water to a the semiconductor apparatuses (6, 10) through a high-temperature cooling-water supply line (32), the high-temperature cooling-water exhausted from the semiconductor manufacturing apparatuses (2, 4) and having a temperature still higher than the medium-temperature cooling-water.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully