Method for forming thin film and catalyzed treatment solution used therefor

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United States of America Patent

APP PUB NO 20040067312A1
SERIAL NO

10674551

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Abstract

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In the catalyst-applying treatment, the sensitization treatment is carried out by dipping the base material which has been subjected to the preliminary treatment in a tin chloride solution applied with a predetermined amount of fluorine type anionic surfactant, and the activation treatment is carried out by dipping the base material which has been subjected to the preliminary treatment in a palladium chloride solution applied with a predetermined amount of fluorine type anionic surfactant.

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Patent Owner(s)

Patent OwnerAddress
YAMAICHI ELECTRONICS CO LTDTOKYO JAPAN TOKYO METROPOLIS
KANAGAWA UNIVERSITY3-27-1 ROKKAKUBASHI KANAGAWA-KU YOKOHAMA-SHI KANAGAWA 2218686

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sato, Yuichi Yokohama-shi, JP 300 4292
Shinbo, Kazuki Kurashiki-shi, JP 2 3
Umehara, Koji Atsugi-shi, JP 1 0
Yonezawa, Akira Tokyo, JP 27 363

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