Treatment device for wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Apr 8, 2004
app pub date -
Oct 16, 2003
filing date -
Oct 24, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A treatment device for cleaning or ashing surfaces of flat wafers (10), wherein at least one flat base plate (30) is provided as an electrode in a treatment chamber (40), said treatment chamber being adapted to be evacuated. Depressions (31) are formed and distributed in said base plate such that they are suitable for receiving support pieces (20), said depressions having at least one arrangement or positioning adapted to a shape of a wafer to be treated. Each support piece has at least one support surface a height of which, after inserting a support piece into a respective depression, comes to rest at a level (a) above the base plate.
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