Nozzle assembly, system and method for wet processing a semiconductor wafer
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United States of America Patent
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Issued Date -
Apr 1, 2004
app pub date -
Aug 14, 2002
filing date -
Aug 14, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system and method for wet cleaning a semiconductor wafer utilizes a nozzle assembly to combine two or more input fluids to form a cleaning fluid at the point-of-use. The input fluids are received at the nozzle assembly and combined in a chamber of the nozzle assembly to form the cleaning fluid. The nozzle assembly may include an acoustic transducer to generate an acoustic energy, one or more valves, e.g., three-way valves, to control the receipt of input fluids and/or a flow control mechanism, e.g., a pressure spring valve, to control dispensing of the cleaning fluid onto a surface of the semiconductor wafer.
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