Window-type ball grid array semiconductor package
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United States of America Patent
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N/A
Issued Date -
Apr 1, 2004
app pub date -
Sep 30, 2002
filing date -
Sep 30, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A window-type ball grid array (WBGA) semiconductor package is proposed, wherein a chip is mounted over an opening formed through a substrate via an adhesive in a manner as to leave regions adjacent to the opening on the substrate uncovered by the adhesive. A first encapsulant is formed to fill the opening and encapsulate bonding wires formed through the opening for electrically connecting the chip to the substrate. A second encapsulant is fabricated to encapsulate the chip. A non-conductive material is applied by a dispensing process to seal gaps formed between the chip and the regions on the substrate, so as to allow the chip to be firmly supported on the substrate during a molding process for fabricating the second encapsulant, and thus to prevent chip cracks from occurrence.
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