Magnetron sputtering apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 18, 2004
app pub date -
Sep 16, 2003
filing date -
Dec 5, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A magnetic assembly (15) is mounted on a lead screw (12) on one side of a spunter target (14). A further lead screw (11) carries a counter weight (16). The lead screws can be rotated by a stepper motor (13) to adjust the lateral positions of assembly (15) and weight (16). The stepper motor and hence the assembly (15), can be rotated about a vertical axis by shaft (17) and motor (18) so that a magnetic field can be swept around the target (14). The position of the assembly (15) is varied in accordance with a process characteristic.
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