Method and apparatus for high speed cutting
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United States of America Patent
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N/A
Issued Date -
Mar 4, 2004
app pub date -
Aug 30, 2002
filing date -
Aug 30, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A workpiece is cut by being selectively moved along a first axis under a cutting device, the cutting device being selectively moved along a second axis that is perpendicular to the first axis. Motion of the workpiece and the cutting device is controlled to cut a workpiece. In one embodiment of the invention, the workpiece is selectively moved along the first axis by actuation of a first linear motor, and the cutting device is selectively moved along the second axis by actuation of a second linear motor. The cutting device may be a high-pressure fluid jet system.
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