Method for fabricating light emitting diode with transparent substrate
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United States of America Patent
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Issued Date -
Mar 4, 2004
app pub date -
May 22, 2003
filing date -
Aug 28, 2002
priority date (Note) -
Abandoned
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Abstract
A method for fabricating a light emitting diode with transparent substrate. The method comprises forming a first type cladding layer on a substrate, forming an active layer on the first type cladding layer, forming a second type cladding layer on the active layer, forming a second type transparent semiconductor layer on the second type cladding layer to serve as the transparent substrate, removing the substrate, and forming a first type contact layer on the surface of the first type cladding layer previously connected to the substrate. The transparent substrate does not absorb the emitted light, thereby the light emitting efficiency is increased by as much as double, and thus the performance of opto-electronic devices is improved.
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