PCB heatsink
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 4, 2004
app pub date -
Aug 27, 2002
filing date -
Aug 27, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heatsink for a printed circuit board (PCB) overlies most or all of the board. It is clamped tightly to the board with its board-facing surface in close proximity to the heat-generating components on the board. A pliant, thermally-conductive dielectric layer is sandwiched between the PCB and the facing surface of the heatsink. Lands at various heights are formed on the heatsink surface facing the PCB to be in good heat-conducting proximity to the surfaces of heat-generating circuit components of various heights on the PCB.
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