Methods for repairing defects on a semiconductor substrate
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United States of America Patent
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Issued Date -
Feb 26, 2004
app pub date -
Apr 29, 2003
filing date -
Mar 24, 2000
priority date (Note) -
Abandoned
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Abstract
The present invention relates to methods for repairing defects on a semiconductor substrate. This is accomplished by selectively depositing the conductive material in defective portions in the cavities while removing residual portions from the field regions of the substrate. Another method according to the present invention includes forming a uniform conductive material overburden on a top surface of the substrate. The present invention also discloses a method for depositing a second conductive material on the first conductive material of the substrate.
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