Structure of a heat dissipation fin
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United States of America Patent
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N/A
Issued Date -
Feb 19, 2004
app pub date -
May 14, 2003
filing date -
Aug 16, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An improved structure of heat dissipation fin for prevention of glue-overflowing in semiconductor packaging includes a substrate and a chip bonding module, wherein the heat dissipation fin is a thin housing structure having a bottom flat section and the center position is provided with a protruded section, forming into a covering body to cover the chip and the bonding body, the top section of the protruded section is provided with a first stepped platform and the inner edge of the platform is further formed into bottom recess structure and the wall thereof is then formed vertically into a raised second stepped protruded ring, and the center at the inner edge of the second stepped protruded ring is formed into a top recessed face, thereby the first stepped ring platform and the second stepped ring platform urge the top face of the top edge of the mold to form into a structure to block the packaging adhesive such that the adhesive will not overflow into the center position of the heat dissipation fin.
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