Method and compound fabric with latent heat effect
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United States of America Patent
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Issued Date -
Feb 12, 2004
app pub date -
Aug 6, 2002
filing date -
Aug 6, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a method and compound fabric for latent heat effect which means a compound fabric capable of undergoing heat storage (release) material for microcapsules with waterborne polyurethane shell which use interfacial condensation polymerization by waterborne polyurethane thereof, such as alkyl alkyrate (alkyric acid alkyl ester) for temperature in the range of 0.degree. C. to 80.degree. C. The fabric is selected from the group of consisting of woven, non-woven and structure of woven, and the present invention provides method to coat waterborne polyurethane shell microcapsules of heat storage (release) material for compound fabric
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