Method of electroless plating and ceramic capacitor
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United States of America Patent
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Issued Date -
Feb 12, 2004
app pub date -
Jan 23, 2003
filing date -
Jan 23, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention provides a method of selectively applying an electroless plating to a ceramic body, comprising: selectively applying an organosilicon polymer plating resist to a surface of the ceramic body to form a protected area having the resist, an unprotected area remaining elsewhere; seeding the unprotected area of the ceramic body, the protected area remaining unseeded; activating the unprotected area of the ceramic body with an aqueous solution of a palladium salt, the protected area remaining unaffected; and carrying out selective electroless plating of the unprotected area without removing the plating resist, leaving the protected areas unplated. The invention also relates to a monolithic ceramic planar array (2) of capacitors having connections formed upon interior faces of cavities in the ceramic by the selective electroless plating method. The invention further relates to the use of an organosilicon polymer as a plating resist to protect a ceamic surface against electroless plating.
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