Sub-mount for high power light emitting diode
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United States of America Patent
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Issued Date -
Feb 12, 2004
app pub date -
Jun 11, 2003
filing date -
Aug 9, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A sub-mount for high power light emitting diode (LED) is disclosed. The sub-mount is a metal substrate, which is successively covered with an insulating layer and a metal layer on a first portion thereof. The flipped LED chip with an n and a p electrode on the same side is respectively, bonded to the metal layer and the exposed metal substrate.
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