Method for selectively metalizing dieletric materials
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United States of America Patent
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Issued Date -
Feb 12, 2004
app pub date -
Aug 4, 2003
filing date -
Sep 26, 2000
priority date (Note) -
Abandoned
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Abstract
Method for selectively metallizing dielectric materials, the method includes: adhesively covering dielectric materials with an activating layer comprising a conductive material, which layer is subsequently structured by way of laser ablation; and using a subsequent laser treatment to structure the activating layer in such a way that discrete conductive structures are formed, which are subsequently metallized.
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