Method and apparatus for integrated chemical mechanical polishing of copper and barrier layers
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United States of America Patent
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Issued Date -
Feb 5, 2004
app pub date -
Mar 13, 2003
filing date -
Mar 13, 2002
priority date (Note) -
Abandoned
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Abstract
A method of polishing a plurality of layers on a surface of a semiconductor wafer includes polishing a first layer using a polishing solution on a first portion of polishing pad and polishing another layer using a polishing solution on another portion of polishing pad. The polishing solution used for each layer is preferably suited to polish its respective layer. The different portions of polishing pad, likewise, are preferably suited to polish a corresponding wafer layer. The different portions of polishing pad may be located on the same pad or on different pads.
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