Slurry for polishing copper-based metal
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United States of America Patent
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Issued Date -
Feb 5, 2004
app pub date -
Jul 21, 2003
filing date -
Aug 2, 2002
priority date (Note) -
Abandoned
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Abstract
A slurry for polishing copper-based metal containing a silica polishing material, an oxidizing agent, an amino acid, a triazole-based compound and water, wherein a content ratio of amino acid to triazole-based compound (amino acid/triazole-based compound (weight ratio)) is 5 to 8.
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