Wiring structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20040017279A1
SERIAL NO

10349964

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention protects a wiring against an etchant when a fuse connected to this wiring is subjected to a laser blow. A fuse has a barrier metal at its lower side. A plug is connected to the lower side of the fuse. The plug has a barrier metal at least at its lower side. Even if the fuse is partly removed through the laser blow at a region other than a portion where the fuse is connected to the plug, two layers of the barrier metals remain between the removed portion and a lower wiring. This enlarges the margin for preventing the adverse influence, such as corrosion and breaking of the lower wiring, brought by an etchant associated in other manufacturing process.

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Patent Owner(s)

Patent OwnerAddress
RENESAS TECHNOLOGY CORPTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Izumitani, Junko Tokyo, JP 28 246
Kamoshima, Takao Tokyo, JP 21 130
Sunada, Shigeki Hyogo, JP 4 15

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