Selective barrier removal slurry
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United States of America Patent
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Issued Date -
Jan 22, 2004
app pub date -
Jul 19, 2002
filing date -
Jul 19, 2002
priority date (Note) -
Abandoned
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Abstract
The invention relates to a selective barrier slurry comprising abrasive particles, a barrier removal chemical, and a pH adjusting agent useful for adjusting the pH of the composition. In particular, the inventive slurry comprises abrasive particles, a barrier removal chemical, and a component useful for adjusting the pH of the composition. The content of the abrasive particles comprise about 0.1% to about 5% of the slurry, preferably from about 1% to about 2%. The pH adjusting component can be any component that is able to adjust the pH of the slurry to the desired range. The final pH of the slurry is alkaline and is preferably in the range of about 7 to about 12, and more preferably in the range of about 9 to about 10. The slurry may also contain additives or surfactants, which can be used to increase the stability of the silica.
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