Thin film acoustic wave device and the manufacturing method thereof

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United States of America Patent

APP PUB NO 20040007940A1
SERIAL NO

10194215

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Abstract

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A thin film acoustic wave device and the manufacturing method thereof, it provides a method of manufacturing acoustic wave devices of different FOM (figures of merit) by means of the crystalline orientation of the piezoelectric layer in cooperated with the various electric field directions of the driving electrode, so as to provide acoustic wave devices that are optimized under various specifications.

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Patent Owner(s)

Patent OwnerAddress
ASIA PACIFIC MICROSYSTEMS INCNO 2 R & D RD VI SCIENCE-BASED INDUSTRIAL PARK HSINCHU BAOSHAN VILLAGE HSINCHU HSIEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Ching-Yee Hsinchu, TW 1 6
Lin, Chung-Hsien Cha-I City, TW 82 1467
Tsai, Shu-Hui Hsin-Chu City, TW 12 317

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