Selective electrochemical deposition methods using pyrophosphate copper plating baths containing ammonium salts, citrate salts and/or selenium oxide
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United States of America Patent
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Issued Date -
Jan 15, 2004
app pub date -
May 7, 2003
filing date -
May 7, 2002
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Abandoned
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Abstract
An electrochemical fabrication process and apparatus are provided that can form three-dimensional multi-layer structures using pyrophosphate copper plating solutions that contain citrate salts, selenium oxide, and/or excess ammonium salts. In some embodiments the citrate salts are provided in concentrations that yield improved anode dissolution, reduced formation of pinholes on the surface of deposits, reduced likelihood of shorting between anode and cathode during deposition processes, and reduced plating voltage throughout the period of deposition. A preferred citrate salt is ammonium citrate in concentrations ranging from somewhat more that about 10 g/L for 10 mA/cm.sup.2 current density to as high as 200 g/L or more for a current density as high as 40 mA/cm. In some embodiments deposits having enhanced ductility and/or reduced tendency to crack are provided.
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