Method of producing copper foil solder bump
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United States of America Patent
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Issued Date -
Jan 8, 2004
app pub date -
May 8, 2003
filing date -
May 9, 2002
priority date (Note) -
Abandoned
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Abstract
The present invention discloses a method of producing a copper foil used for a printed circuit board (PCB). In this method of producing a copper foil for a solder bump, metal surfaces are activated by plasma or primer treatment and finally are clad using a pressing means in a process of cladding a copper foil constituting a bump and a copper foil forming a circuit. Therefore, it is possible to produce a copper foil for a PCB with excellent adhesion strength without carrying out any bump forming process.
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