Semiconductor package with heat sink
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United States of America Patent
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N/A
Issued Date -
Jan 8, 2004
app pub date -
Oct 4, 2002
filing date -
Jul 3, 2002
priority date (Note) -
Abandoned
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Abstract
A semiconductor package with a heat sink is provided, wherein a substrate is formed with a metal core layer and at least an opening that penetrates through the substrate. At least a semiconductor chip is mounted on the substrate, with bond pads formed on the semiconductor chip being exposed to the opening, so as to allow the semiconductor chip to be electrically connected to the substrate by a plurality of gold wires that are bonded to the bond pads and formed through the opening. The metal core layer of the substrate provides a grounding plane to improve electrical quality of the semiconductor package, and acts as a heat sink to enhance heat-dissipating efficiency of the semiconductor package. Moreover, an encapsulant for encapsulating the semiconductor chip contains a plurality of thermally conductive metal particles to further facilitate dissipation of heat produced from the semiconductor chip.
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