Semiconductor package with reinforced substrate and fabrication method of the substrate
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United States of America Patent
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Issued Date -
Jan 8, 2004
app pub date -
Dec 5, 2002
filing date -
Jul 3, 2002
priority date (Note) -
Abandoned
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Abstract
A semiconductor package with a reinforced substrate and a fabrication method of the substrate are provided. The substrate is formed of a metal core layer with relatively high rigidity, and an insulating layer is coated on at least a surface of the core layer. At least a ground via is formed through the insulating layer, allowing a chip mounted on the substrate to be electrically connected and grounded to the substrate by the ground via. The reinforced substrate provides the semiconductor package with sufficient mechanical strength, and can be reduced in thickness in favor of package profile miniaturization. Moreover, the substrate made of the metal core layer and insulating layer has a relatively small dielectric constant to facilitate electron transmission velocity, thereby improving electrical quality of the semiconductor package. Furthermore, the metal core layer is made of a thermally-conductive metallic material, and enhances heat dissipating efficiency of the semiconductor package.
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