High temperature tag having enclosed transceiver
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United States of America Patent
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app pub date -
Jul 8, 2003
filing date -
Oct 24, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A high temperature RFID tag is provided that is adapted to receive thermal transfer print to provide indicia on an outer surface thereof and adapted to be disposed on a part that is subject to high temperature exposure. The RFID tag is formed as a lamination of a high temperature material such as high temperature polyester and including a window for an RFID generator component, a layer of high temperature resistant material that overlies the opening, and an adhesive material disposed in the window to secure the RFID generator component therein. The layer of high temperature resistant material is preferably transparent so that the indicia can be seen therethrough.
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