Circuit board for flip-chip semiconductor package and fabrication method thereof
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United States of America Patent
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N/A
Issued Date -
Jan 8, 2004
app pub date -
Dec 5, 2002
filing date -
Jul 3, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A circuit board for a flip-chip semiconductor package and a fabrication method of the circuit board are provided. A core layer is coated with a resin material on a surface thereof where a plurality of bond pads are formed. Laser-etching technology is adopted to form a plurality of openings through the resin material corresponding in position to the bond pads, whereby the bond pads are exposed via the openings to be bonded with solder balls or bumps, so as to allow the circuit board to be electrically connected to an external device or a chip via the solder balls or bumps. This circuit board is beneficial to allow precise exposure of the bond pads in position, which can improve quality and yield of the circuit board and make the circuit board suitably applied to high-level products with fine-pitch arrangement of conductive elements for electrical connection purposes.
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