Curable resin composition useful for coating, multi-layer printed wiring board, printed wiring board and dry film
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 1, 2004
app pub date -
May 6, 2003
filing date -
Jun 28, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed are a curable resin composition which is capable of forming a low dielectric interlayer insulating material wherein the attenuation of signals due to an enhancement in frequency of circuit can be hardly attenuated, a multi-layer printed wiring board or a printed wiring board each provided with a cured film thereof, and a dry film provided with a semi-cured filmy coating. This curable resin composition comprises a polyfunctional vinylbenzyl ether and a curing promotor. This curable resin composition may further comprise a photosensitive resin, a photopolymerization initiator and a diluent, thus forming a photosensitive/thermosetting resin composition.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully