Method of making interactive information closure and package
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United States of America Patent
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Issued Date -
Dec 25, 2003
app pub date -
Dec 6, 2002
filing date -
Jan 9, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be positioned within a mold cavity within which a plastic closure is subsequently molded. The microelectronics assembly is thus integrated with the closure, such as by disposition on either the exterior or interior of a top wall portion of the closure. The closure can be provided with a sealing liner positioned adjacent an inside surface of the top wall portion.
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