Strengthened bonding mechanism for semiconductor package
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United States of America Patent
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app pub date -
Jun 20, 2002
filing date -
Jun 20, 2002
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Abstract
A strengthened bonding mechanism for a semiconductor package is proposed. An aluminum pad formed on a chip is formed with a UBM (under bump metallurgy) structure, on which a tin layer is applied. Moreover, a copper pad formed on a substrate or printed circuit board is formed with a tin layer thereon. Thereby, a solder ball or bump is adapted to be bonded to the tin layer for electrical connection purpose. With provision of the tin layer, the solder ball or bump would be strongly bonded to the bonding mechanism without being easily subject to breaking or cracking, thereby making reliability of fabricated products firmly assured. As such, bonding mechanisms can be densely arrangement so as to reduce pitch spacing between adjacent solder balls or bumps bonded to the bonding mechanisms, in favor of fine-pitch structural arrangement for facilitating electrical connection efficiency.
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