Technique for packaging an optical module
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United States of America Patent
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Issued Date -
Dec 18, 2003
app pub date -
Mar 18, 2003
filing date -
Mar 18, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A technique for packaging an optical module is disclosed. In one particular exemplary embodiment, the technique may be realized as an optical module packaging apparatus comprising an optical module having a first slip-fit engagement means, at least one support rail for supporting the optical module, and an end cap attached to the at least one support rail. The optical module packaging apparatus may also comprise an enclosure for enclosing the optical module and the at least one support rail and engaging the end cap, wherein the enclosure has a second slip-fit engagement means for engaging the first slip-fit engagement means.
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