Surface mountable laminated circuit protection device
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United States of America Patent
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Issued Date -
Dec 11, 2003
app pub date -
May 5, 2003
filing date -
Jun 6, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention discloses a surface mountable laminated circuit protection device by using a conductive composite material with PTC characteristics. The design of the invention enables the combinational arrangements of a top electrode, a bottom electrode and an insulating material between electrodes without using a conductive mechanism between the top electrode and the bottom electrodes to make a surface mountable polymeric circuit protection device, and can use the current double-layer metal-foil clad substrate as a processing substrate, make the processing of the protection device easier, and have better structural strength and dimension stability.
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