Rack mountable computer component cooling method and device
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United States of America Patent
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N/A
Issued Date -
Dec 4, 2003
app pub date -
May 29, 2003
filing date -
May 31, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to at least one of the disclosed embodiments of the present invention, there is provided a method and apparatus for mounting heat sinks for a rack mounted computer component. The heat sink is adapted to be mounted on a vertically mounted computer component blade where the heat sink is disposed such that vertical air flow provides sufficient contact with the heat sink fins for efficient and rapid cooling purposes.
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