Solder paste flux system
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United States of America Patent
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Issued Date -
Dec 4, 2003
app pub date -
May 30, 2002
filing date -
May 30, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is directed to a solder flux and solder paste that comprises methylsuccinic acid as an activating component and an imidazole compound as an accelerating component. The imidizole compound is selected from the following: 2-methyl-4-ethylimidazole, 2-methylimidazole and 2-ethylimidazole and mixtures thereof. The present invention is also directed to a method for preparing the above-described solder flux and method for soldering using the solder flux paste. It is also directed to an electronic component assembly joined using the solder flux paste.
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