Method of forming connections on a conductor pattern of a printed circuit board
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United States of America Patent
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N/A
Issued Date -
Nov 6, 2003
app pub date -
Dec 27, 2002
filing date -
May 1, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of making connections on a conductor pattern of a PCB comprises the steps of: a) Prepare a substrate with a conductive layer at a side thereof b) Form the conductive layer to a conductor pattern having first portions and second portions, wherein the first portions and a second portions have difference in height, and c) Provide an insulating layer on the substrate for sheltering the second portions of the conductor pattern but exposing the first portions of the conductor pattern. The first portions can plate Ni--Au layers on the exposed parts thereof to form interconnections to electrically connect the conductor pattern with another electronic device. The first portion also can be interfacial connections to connect the conductor patterns at different layers in a multi-layer PCB.
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