Solventless photo-sensitive thermosetting-type ink
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United States of America Patent
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Issued Date -
Oct 30, 2003
app pub date -
Apr 26, 2002
filing date -
Apr 26, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a solventless photo-sensitive thermosetting type of material, a method for manufacturing the same, and its use; wherein said solventless photo-sensitive thermosetting type of material mainly comprises an aqueous alkaline-developable photo-sensitive resin, unsaturated monomer(s), epoxy resin(s), photo initiator(s), and is manufactured through a ring-opening condensation reaction as an initiation step, which is characterized in that a photo-sensitive monomer containing an unsaturated bond is used to replace organic solvent(s) regularly used in conventional solder mask products.
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