System and method of laser sintering dies and dies sintered by laser sintering

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United States of America Patent

SERIAL NO

10442129

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Abstract

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A laser sintering system is provided for sintering a die having a serrate edge. The laser sintering system comprises a laser generator for generating a laser beam and a movable carriage for carrying said die. The laser beam sinters the serrate edge of said die into a smooth edge. A method of sintering a die, the die having a serrate edge, comprises the following steps of providing a die and using a laser beam sintering the serrate edge of said die into a smooth edge. A die has a smooth edge sintered by a laser beam.

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Patent Owner(s)

Patent OwnerAddress
CHIPBOND TECHNOLOGY CORPORATIONNO 3 LIHSIN 5 RD HSINCHU SCIENCE PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwan, Lu-Chen Hsinchu, TW 20 156
Yiu, Dang-Cheng Hsinchu, TW 2 7

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