Semiconductor memory module
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United States of America Patent
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N/A
Issued Date -
Oct 30, 2003
app pub date -
Oct 22, 2002
filing date -
Apr 24, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A good chip for repair is provided only in a position on the rear surface of a module substrate corresponding to the position of a bare chip that has been detected as being defective. In addition, the entirety of the rear surface of the module substrate is integrally molded regardless of whether or not a good chip is mounted. Thereby, a semiconductor memory module is formed so as to be in a form wherein gaps do not easily occur between a plurality of semiconductor memory modules when the semiconductor memory modules are packed in a box for transport of the semiconductor memory modules. As a result, damage can be prevented from occurring in a semiconductor module wherein good chips for repair are mounted at the time of transport in packaging.
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