Flip chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 30, 2003
app pub date -
May 23, 2002
filing date -
Apr 30, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A flip chip package has a substrate made of a material including an epoxy resin. A solder mask is one layer of an epoxy resin disposed on the top surface of the substrate. The solder mask has a smooth outer surface and a plurality of opening to expose the conductive patterns formed on the top surface. An IC chip includes an active side having a plurality of electrical contact pads. A plurality of solder bumps, each bump is formed on a respective one of the plurality of contact pads on the IC chip. The active side of the IC chip is tightly attached to the outer surface of the solder mask such that after a soldering process each said bump has a remainder completely received in a respective one of the opening of the solder mask and connected to the conductive patterns therein.
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