Method for fabricting a resistor on a printed circuit board
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United States of America Patent
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Issued Date -
Oct 16, 2003
app pub date -
Apr 10, 2002
filing date -
Dec 31, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for fabricating a resistor on a printed circuit board (PCB) uses a resistance film material and a dry etching process to form a resistor on the PCB. The resistance film material has low dissolvent content to prevent the resistor from shrinking and affecting the resistance of the resistor. The resistance film material has a fixed thickness, so the thickness of the resistor in the PCB is easily controlled. Furthermore, the method uses a dry etching process to precisely form the resistor on the PCB to make the length and width of the resistor pattern very accurate.
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