Method for fabricating resistors on a printed circuit board
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United States of America Patent
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Issued Date -
Oct 16, 2003
app pub date -
Apr 10, 2002
filing date -
Apr 10, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for fabricating a resistor on a printed circuit board (PCB) uses a resistance film material, an exposure process, a photographic negative and a development process to fabricate a resistor on the PCB. The resistance film material has low content of dissolvent to prevent the resistor from shrinking and affecting the resistance of the resistor. The resistance film material has a fixed thickness, so that the thickness of the resistor in the PCB is easily controlled. Furthermore, the method uses an exposure and development process and the negative to from the resistor pattern on the PCB to make the length and width of the resistor pattern very accurate.
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