Method for forming soldering layer of fiber arrays
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United States of America Patent
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Issued Date -
Oct 16, 2003
app pub date -
Apr 11, 2003
filing date -
Apr 12, 2002
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Abstract
ABSTRACT OF THE DISCLOSURE A method for forming the soldering layer of fiber array substrate surface has been disclosed herein. A plurality of fiber array bases having V-shape grooves are formed on a substrate, and a solder layer is formed on the whole substrate via chemical plating method of following steps: forming a layer of nickel/chromium (Ni/Cr) alloy or aluminum (Al) metal on said substrate through evaporation or sputtering; treating said surface of said substrate having V-shape grooves with a sensitizing solution for plating said surface with Sn.sup.2+, wherein said sensitizing solution comprises deionized water and SnCl.sub.2; treating said sensitized surface of said substrate with an activating solution for precipitating catalytic element Pd.sup.0 on said surface, wherein said sensitizing solution comprises 2 to 10 g/l of PdCl.sub.2 and 0.01 to 0.1 M HCl; and (E) immersing said treated surface into an electroless nickel plating solution to form a nickel metal layer on said treated surface.
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