Composition for sealing a semiconductor device, semiconductor device and method of manufacturing the same
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United States of America Patent
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Issued Date -
Oct 16, 2003
app pub date -
Jun 1, 2001
filing date -
Dec 2, 1998
priority date (Note) -
Abandoned
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Abstract
A composition for sealing a semiconductor device contains polyphenylene sulfide wherein a line expansion coefficient at 150.degree. C. to 200.degree. C. is 4.75.times.10.sup.-5 [1/.degree. C.] or less, a line thermal expansion coefficient at 80 to 130.degree. C. is 6.0.times.10.sup.-5 [1/.degree. C.] or less, and a line expansion coefficient ratio between the flow direction and a normal direction of the flow direction is 0.55 or more.
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